MediaTek Expands Deca-Core SoC Lineup; Launches Helio X23, Helio X27

MediaTek has expanded its deca-core Helio lineup with the launch of upgraded mobile processors - Helio X23 and Helio X27. With the launch of the two new Helio processors, MediaTek Helio X20 family now has four deca-core chips including X20 and X25, which were launched earlier this year.

The Taiwanese chipmaker says that smartphones powered by Helio X23 and Helio X27 will be available soon. The new Helio X23 and Helio X27 feature the tri-cluster deca-core architecture with two cores of ARM Cortex-A72; four cores of ARM Cortex-A53, and four cores of ARM Cortex-A53. It also comes with MediaTek CorePilot 3.0 technology.

The new Helio X23 and Helio X27 also support dual camera photography with the upgraded MediaTek Imagiq image-signal-processing solution, which integrates color and mono cameras alongside depth-of-field applications into a single ISP to improve quality and functionality of photography.

"MediaTek Helio X23 and X27 boast significant improvements in image clarity, saturation, exposure control, portrait performance, and large aperture applications optimized through the color+mono smart dual camera and dual phase-detection systems," the company said.

Announcing the new SoCs, Jeffrey Ju, Executive Vice President and Co-Chief Operating Officer at MediaTek said, "The MediaTek Helio platform fulfills the diverse needs of device makers. Based on the success of MediaTek Helio X20 and X25, we are introducing the upgraded MediaTek Helio X23 and X27. The new SoCs support premium dual camera photography and provide best-in-class performance and power consumption."

The new chips also include MiraVision EnergySmart screen power-saving technology, which modifies the smart display parameters and reduces display power consumption by up to 25 percent. The Helio X23 and Helio X27 comes with envelope tracking module which is claimed to provide power-efficiency averaging a 15 percent reduction in power consumption during peak output.

Source: MediaTek

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Qualcomm's Next Flagship SoC Will be Called Snapdragon 835

Qualcomm has announced that its next flagship SoC for Android devices will be called the Snapdragon 835 which will be fabricated by Samsung on a 10nm FinFET process. The new chip will replace this year's Snapdragon 820 and Snapdragon 821 chips, and the first devices built around it will most likely debut at the next edition of the annual Mobile World Congress trade show in February 2017.

Details of the new Snapdragon 835's capabilities and specifications are limited. Qualcomm has only said that production is already underway. The new 10nm process should result in lower power draw per SoC, improving the device's battery efficiency and delivering higher performance. Qualcomm says that the Snapdragon 835 will be able to deliver up to 27% higher performance while drawing 40% less power compared to the current 14nm Snapdragon 820 and 821.

However, the company has detailed its new Quick Charge 4.0 feature, which will first be supported by the Snapdragon 835. Quick Charge 4.0 improves on its predecessors by allowing devices to charge faster and more efficiently. The company suggests that a five-minute charge will be enough to give users 4-5 hours of life and that a typical device's battery could charge up to 50% in 15 minutes.

Real-time thermal management will improve safety, and both voltage and current can be monitored and regulated throughout the charging process to avoid overcharging.

Compared to Quick Charge 3.0, Qualcomm projects 20% faster charging and 30% higher efficiency. Moreover, the standard will be fully compliant with the USB Power Delivery standard and the USB Type-C specification, which should improve interoperability between the devices and chargers shipped by various companies.

In a related development, Qualcomm has also announced the launch of a $15,000 (approximately Rs. 10,19,635) bug bounty reward program under which security researchers, also known as white hat hackers, will be invited to test the company's SoCs, LTE modems and other products. The reward will be $15,000 per major vulnerability discovered and reported. Initially, the program will be open only to 40 or so known researchers who Qualcomm has worked with before.

Source: Qualcomm Snapdragon Blog

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OnePlus 4 Tipped to Sport Snapdragon 830 SoC, Launch in June-July

OnePlus is revelling in the success of the OnePlus 3 but looks like the company may have already started work on next year's flagship. A fresh leak hints that the OnePlus 4 will be powered by the yet-to-be-released Snapdragon 830 processor, and will be launched sometime in June-July.

The timeframe leaked on Weibo is in line with Oneplus' usual flagship announcement period. Notably, the OnePlus 3 was unveiled this year in June as well. The Snapdragon 830 chipset has not been officially announced by Qualcomm, but Samsung last month went ahead and revealed its existence, saying it would be built on its 10nm manufacturing process.

The chip is rumoured to have an octa-core setup, support 4K display resolutions, and up to 8GB of RAM. The upcoming Samsung Galaxy S8, the extraordinary Turing phones, and the Microsoft Surface Phone are also expected to sport this new Snapdragon 830 processor.

Furthermore, the OnePlus 4 is rumoured to have 6GB of RAM, and the processor is expected to be clocked at 3GHz. It will run on Android Nougat-based-OxygenOS out-of-the-box and may pack a 4000mAh battery. To recall, the OnePlus 3 packs a 3000mAh non-removable battery.

The latest chipset offering from Qualcomm currently is the Snapdragon 821. OnePlus is expected to unveil an upgraded OnePlus 3T variant with this processor sometime in December. It is rumoured to run on the latest Android 7.0 Nougat-based Oxygen OS out-of-the-box, and sport a 16-megapixel Sony IMX398 sensor. There's also a rumoured shift to LCD panel instead of the Optic OLED display, and the price is expected to increase to $479 (roughly Rs. 32,100).

Source: Weibo

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